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Advances in the performance and accuracy of design automation software and electromagnetic modeling have enabled RFIC designers to apply their skills to achieve first pass silicon success for complex mixed-signal radio circuits. Now, coupling between circuit simulation and parameterized electromagnetics allows them to include detailed analysis of packaging and printed circuit board parasitic coupling to analyze system performance. A silicon vendor may produce a wireless SoC that performs flawlessly at the packaged part level. Once that part is placed on a system PCB, the complex interactions among traces on the board, the coupled impedances between package pins and the PCB, and nonlinear effects in the circuit itself can combine to generate spurious radiation and corrupt signal/power integrity. These undesired effects can be predicted by applying full electromagnetic simulation of the package and board in concert with a top-level transient or harmonic balance simulation at the circuit level. We present here an overview of key simulation technologies and discuss how they can be applied to achieve first pass system success for complex electronic products.