Scheduled System Maintenance on May 29th, 2015:
IEEE Xplore will be upgraded between 11:00 AM and 10:00 PM EDT. During this time there may be intermittent impact on performance. We apologize for any inconvenience.
By Topic

Detection and Characterization of Buried Macroscopic Cracks Inside Dielectric Materials by Microwave Techniques and Artificial Neural Networks

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Maazi, M. ; Inst. d''Electron. de Microelectron. et de Nanotechnol., Univ. of Lille, Villeneuve dAscq ; Benzaim, O. ; Glay, D. ; Lasri, T.

The detection and characterization of macroscopic cracks inside dielectric materials is an important practical issue. Thus, there is a need to establish evaluation techniques, which can be used to characterize buried cracks; indeed, the knowledge of the geometrical configuration of a hidden crack is a key factor for fatigue crack engineering. Therefore, a microwave method for nondestructive characterization of macroscopic cracks inside dielectric materials is presented in this paper. This nondestructive and noncontact technique is based on the determination of the near-field reflection coefficient of an open-ended rectangular waveguide. The measurements are achieved by means of a microwave six-port-based system that operates at 35 GHz. We show that relatively small defects are detectable and demonstrate that the association of signal processing tools to this characterization method enables the retrieval of the crack profile in an acceptable manner. The reconstruction of a 1-D buried crack profile is performed by means of a multiple-multilayer-perceptron (MLP) approach. Several cases are investigated to demonstrate the capabilities of the method.

Published in:

Instrumentation and Measurement, IEEE Transactions on  (Volume:57 ,  Issue: 12 )