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Enhanced 3-D Folding of Silicon Microstructures via Thermal Shrinkage of a Composite Organic/Inorganic Bilayer

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3 Author(s)
Ming-Fang Wang ; Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN ; Teimour Maleki ; Babak Ziaie

Although 3-D out-of-plane structures based on the thermal shrinkage of polyimide-filled V-grooves have already been demonstrated, for large bending angles, this method typically requires several V-grooves and high curing temperatures, which are real-estate consuming and can damage temperature-sensitive components. In this paper, we show that the addition of an inorganic layer (called the boosting layer) beneath the V-grooves can significantly enlarge the bending angle without requiring more V-grooves or higher curing temperatures. For example, a 2- -thick boosting layer can raise the bending angle of a single V-groove joint by a factor of seven. In addition, the boosting layer removes the requirement for a V-groove and permits the use of straight-wall dry-etched grooves, hence allowing a sharper curvature in a smaller area.

Published in:

Journal of Microelectromechanical Systems  (Volume:17 ,  Issue: 4 )