High performance organic dielectrics and high density substrates for next generation System on a Package (SOP) technology

This paper introduces a new developmental family of thin film dielectric materials that have low dielectric constant (2.5 - 3.1 ) and low loss tangent (<0.005) at 10 GHz and discusses process development and reliability testing of a 1-2-1 substrate stack-up with versions of these high-performance developmental dielectrics (RXP-4). The variant used in these experiments is called RXP-4a. Various conditions were tried to optimize processing and reliability. Fine line structures down to 14 mum have been demonstrated. These were also found to pass reliability testing. Additionally, FE modeling was performed to understand the predicted reliability of microvias in these RXP-4 materials.