Referenced Items are not available for this document.
In this paper, we studied the wire bonding ability and the solder joint reliability for electrolytic Ni/Au and ENEPIG. For studying wire bonding ability, 4N wire with 20 mum in diameter was used. Pull strength of Au wire and failure mode after each pull test were both the criteria of wire bonding. After wire pull test, the pull strength and failure mode of Electrolytic Ni/Au and ENEPIG were similar. Therefore, it could be supposed the wire bonding ability of ENEPIG is similar with electrolytic Ni/Au. For solder joint reliability, different types of solder joint test were conducted- conventional ball shear test, cold-ball pull test. High speed ball shear test was also applied to simulate high strain rate loading, similar as drop test. Failure mode and micro analysis were carried out by the analytical tools, including scanning electron microscope (SEM) and energy dispersive spectrometer (EDX).
Published in:
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Date of Conference: 27-30 May 2008
- Page(s):
- 1931 - 1935
- ISSN :
- 0569-5503
- E-ISBN :
- 978-1-4244-2231-9
- Print ISBN:
- 978-1-4244-2230-2
- INSPEC Accession Number:
- 10057211
- Conference Location :
- Lake Buena Vista, FL
- Digital Object Identifier :
- 10.1109/ECTC.2008.4550246
- Product Type:
- Conference Publications
About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies
A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.
