Referenced Items are not available for this document.
An LCP flex based interconnect that significantly improves the interconnect density and supports data rates in the range of 10 to 16 Gbps is evaluated to enable future high bandwidth module based memory systems without requiring complex equalization techniques. A mating two-piece, low- profile, high density and small insertion force connector is developed for interfacing the flex to a flip-chip package. The 216 pin connector can support 72 differential pairs in a 6 times 12 array.
Published in:
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Date of Conference: 27-30 May 2008
- Page(s):
- 1132 - 1138
- ISSN :
- 0569-5503
- E-ISBN :
- 978-1-4244-2231-9
- Print ISBN:
- 978-1-4244-2230-2
- INSPEC Accession Number:
- 10057091
- Conference Location :
- Lake Buena Vista, FL
- Digital Object Identifier :
- 10.1109/ECTC.2008.4550118
- Product Type:
- Conference Publications
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