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Legislation that mandates the banning of lead (Pb) in electronics due to environmental and health concerns has been actively pursued in many countries during the past fifteen years. Lead-free electronics will be deployed in many products that serve markets where the reliability is a critical requirement. Although a large number of research studies have been performed and are currently under way in the lead- free soldering area, especially on the reliability of SAC lead- free solder joints, data on comparison of SAC solders with other lead-free solders (such as SCN) is still scarce. This paper presents a systematic reliability study of lead- free solder joints with different solder alloys. The printed circuit board test assemblies include two kinds of components (QFN and PBGA), with different terminal metallurgies and five kinds of lead-free solder pastes (SAC305, SAC387, SACC, SACS and SCN). The results and analysis of different reliability tests (accelerated thermal cycling, package shear/pull, bending and drop tests) with five kinds of solders are discussed.