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How far can we go in wireless testing of memory chips and wafers?

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1 Author(s)
Cheng-Wen Wu ; Nat. Taiwan Univ., Taipei

Summary form only given. Test cost has become a significant portion of the cost structure in advanced semiconductor memory products. To address this issue at both the wafer and packaged-chip levels, we propose HOY - a novel wireless test system with enhanced embedded test features. In this talk we will briefly outline Project HOY and the test systems and applications it defines, with focus on memory chips and wafers. Our vision is that high-end memory IC testing can go wireless in a few years. Therefore, HOY is intended as a next-generation memory test system, with wireless communication and enhanced embedded test features, such as built-in self test (BIST) and built-in self-repair (BISR).

Published in:

Memory Technology, Design and Testing, 2007. MTDT 2007. IEEE International Workshop on

Date of Conference:

3-5 Dec. 2007

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