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Nano-scaled SRAM thermal stability analysis using hierarchical compact thermal models

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4 Author(s)
Kulkarni, J.P. ; Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN ; Meterelliyoz, M. ; Roy, K. ; Murthy, Jayathi

Non-uniform temperature profile generated by hot- spots affect the nearby units in a chip. Different sections of a large sized cache memory would experience different failure statistics due to their proximity to the hot-spots. The nano-scaled SRAM (Static Random Access Memory) cell stability is analyzed systematically under such 'spatial' temperature variations for different technologies. The bitcell level compact thermal models are generated for 65 nm, 45 nm, 32 nm and 22 nm bulk CMOS technology nodes based on the 6 T 'thin-cell' structure. Next, the block level and system level 'macro' thermal models are generated hierarchically for each technology node. A prominent effect 'leakage induced stability degradation' is observed at 22 nm node. This work demonstrates that leakage reduction techniques should consider temperature/stability aspects in nano-scaled SRAM cells.

Published in:

Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on

Date of Conference:

28-31 May 2008