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System level thermal performance optimization of leaded packages for automotive applications

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1 Author(s)
Victor Adrian Chiriac ; Freescale Semicond. Inc., Tempe, AZ

The conjugate steady-state and transient thermal performance of leaded package (30 Id HSOP) for automotive application in a custom environment is evaluated and further optimized using numerical simulation and experimental validation. The automotive industry deals on a daily basis with multiple packaging and module-level thermal issues when reducing the size of components, while managing the routing of very high current. The study provides a better understanding of the strengths and weaknesses of the package incorporation into a system level, as well as the important thermal role played by the interface materials, for both present and future product development. The reference design is evaluated at system level using JEDEC standard boards under appropriate setup conditions. After several improvements are identified, both steady-state and transient cases satisfy the thermal budget under various operating conditions. The thermal grease (interface material) film variation from 40 mils to 10 mils leads to a temperature drop of ~ 40degC. The case is further used for experimental validation. Under certain circumstances, the thickness of the film is difficult to measure/estimate with high precision, thus it is extracted from the numerical simulations under same powering and ambient conditions. The numerical simulation matches the measurement results for a film thickness in the range ofThe conjugate steady-state and transient thermal performance of leaded package (30 Id HSOP) for automotive application in a custom environment is evaluated and further optimized using numerical simulation and experimental validation. The automotive industry deals on a daily basis with multiple packaging and module-level thermal issues when reducing the size of components, while managing the routing of very high current. The study provides a better understanding of the strengths and weaknesses of the package incorporation into a system level, as well as the important thermal role played by the - interface materials, for both present and future product development. The reference design is evaluated at system level using JEDEC standard boards under appropriate setup conditions. After several improvements are identified, both steady-state and transient cases satisfy the thermal budget under various operating conditions. The thermal grease (interface material) film variation from 40 mils to 10 mils leads to a temperature drop of ~ 40degC. The case is further used for experimental validation. Under certain circumstances, the thickness of the film is difficult to measure/estimate with high precision, thus it is extracted from the numerical simulations under same powering and ambient conditions. The numerical simulation matches the measurement results for a film thickness in the range of 18-20 mils. Several interface materials are being evaluated and the thermal performance of the package in a custom environment is determined and further optimized. 18-20 mils. Several interface materials are being evaluated and the thermal performance of the package in a custom environment is determined and further optimized.

Published in:

Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on

Date of Conference:

28-31 May 2008