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An experimental study is realized in order to verify the mini heat pipe concept for cooling high power dissipation electronic cards. Two kinds of card substrate are considered: alumina and FR4 epoxy substrates, and the chip on board technology is used. Different prototypes of configurations on reporting the chip on the card are tested. The thermal measurements show that the use of heat pipes allows for significantly reduced temperature gradients and maximum chip temperature decrease.
Published in:
Design and Technology of Integrated Systems in Nanoscale Era, 2008. DTIS 2008. 3rd International Conference on
Date of Conference: 25-27 March 2008
- Page(s):
- 1 - 6
- E-ISBN :
- 978-1-4244-1577-9
- Print ISBN:
- 978-1-4244-1576-2
- INSPEC Accession Number:
- 10042979
- Conference Location :
- Tozeur
- Digital Object Identifier :
- 10.1109/DTIS.2008.4540211
- Product Type:
- Conference Publications
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