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The intermediate semiconductor layer for the ohmic contact to silicon carbide by Germanium implantation

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5 Author(s)
Hui Guo ; Microelectron. Sch., Xidian Univ., Xi''an ; Da-yong Qiao ; Yue-hu Wang ; Yu-ming Zhang
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An array of TLM(transfer length method) test patterns is formed on N-wells created by P+ ion implantation into Si-faced p-type 4H-SiC epilayer. The Ge+ ion implantations are used to form the intermediate semiconductor layer (ISL) of nickel-metal ohmic contacts to n-type 4H-SiC. The specific contact resistance pc as low as 4.23 times 10-5 Omegacm2 is achieved after annealing in N2 at 800 degC for 3 min, which is much lower than that (>900degC) in the typical SiC metallization process. The sheet resistance Rsh of the implanted layers is 1.5 kOmega/square. A graphite capping layer is used to protect the surface of SiC during post-implantation annealing.

Published in:

Junction Technology, 2008. IWJT '08. Extended Abstracts - 2008 8th International workshop on

Date of Conference:

15-16 May 2008