We are currently experiencing intermittent issues impacting performance. We apologize for the inconvenience.
By Topic

RF Low-Pass Design Guiding Rules to Improve PCB to Die Transition Applied to Different Types of Low-Cost Packages

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Cubillo, J.R. ; Inst. Mater. Microelectron. Nanosci. de Provence, Univ. Paul Cezanne, Marseille ; Gaubert, J. ; Bourdel, S. ; Barthelemy, H.

We present in this paper some design rules to improve the signal integrity (SI) of a package transition. The design rules are based on standard low-pass (LP) filter synthesis methodology. This methodology uses the modeling of the package transition by a pi network and is valid as long as the through phase shift of the package transition remains sufficiently small. Based on this pi network approximation, it is possible to add external distributed elements at the package carrier level and lumped elements at the DIE level to build an equivalent low-pass ladder filter. This approach improves significantly the signal integrity properties of the package transition without modifying the package. In some cases the frequency bandwidth for which the return loss (RL) remains higher than 20 dB can be doubled by using this method.

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:31 ,  Issue: 3 )