By Topic

Corrections to “Use of Elastic Conductive Adhesive as the Bonding Agent for the Fabrication of Vertical Structure GaN-Based LEDs on Flexible Metal Substrate” [1 Apr 08 523-525]

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

10 Author(s)

In the above titled paper (ibid., vol. 20, no. 7, pp. 523-525, 1 Apr 08), there were errors in Table I. The correct table is presented here.

Published in:

Photonics Technology Letters, IEEE  (Volume:20 ,  Issue: 12 )