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Interconnect Etch Tool Sensitivity to Wafer Backside Composition and Process Induced Defects

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5 Author(s)
Frankwicz, P.S. ; Nat. Semicond. Corp., Portland, ME ; Plourde, C. ; Rothwell, S. ; Kennedy, L.
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Semiconductor manufacturing tools exhibit complex responses to changes in wafer backside chemical composition and quality that result in process tool malfunctions. This can result in costly scrap wafers during processing and wafer yield degradation by process induced defects. This paper details a process - manufacturing excursion involving a wafer backside etch process that negatively impacted manufacturing on metal interconnect etch process toolsets.

Published in:

Advanced Semiconductor Manufacturing Conference, 2008. ASMC 2008. IEEE/SEMI

Date of Conference:

5-7 May 2008