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TXRF Applications Supporting Yield Enhancements and Tool Monitor-ing in Order to Improve the Front-End Semiconductor Processing

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1 Author(s)
Budri, T. ; Nat. Semicond., Portland, ME

In this paper, we summarize how the introduction of in-line TXRF monitoring provides detailed analytical information on aluminum, titanium and molybdenum contamination levels in order to improve several process steps from front- end processing, minimize product yield loss and make it possible to successfully manufacture multiple products and process geometries in the same fabrication platform.

Published in:

Advanced Semiconductor Manufacturing Conference, 2008. ASMC 2008. IEEE/SEMI

Date of Conference:

5-7 May 2008