Close category search window
 

Effects of Oxynitride Buffer Layer on the Electrical Characteristics of Poly-Silicon TFTs Using \hbox {Pr}_{2}\hbox {O}_{3} Gate Dielectric

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Tung-Ming Pan ; Dept. of Electron. Eng., Chang Gung Univ., Taoyuan ; Tin-Wei Wu

In this paper, we have developed high-k Pr2O3 poly-Si thin-film transistors (TFTs) using different N2O plasma power treatments. High-k Pr2O3 poly-Si TFT devices using a 200-W plasma power exhibited better electrical characteristics in terms of high effective carrier mobility, high driving current, small subthreshold slope, and high ION/IOFF current ratio. This result is attributed to the smooth Pr2O3/poly-Si interface and low interface trap density. Pr2O3 poly-Si TFT with a 200-W N2O plasma power also enhanced electrical reliabilities such as hot carrier and positive bias temperature instability. All of these results suggest that a high-k Pr2O3 gate dielectric with the oxynitride buffer layer is a good candidate for high-performance low-temperature poly-Si TFTs.

Published in:
Electron Devices, IEEE Transactions on  (Volume:55 ,  Issue: 6 )

Date of Publication: June 2008

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.