By Topic

Effect of aging of packaging materials on die surface cracking of a SiP carrier

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

9 Author(s)
Xiaosong Ma ; Delft University of Technology, Mekelweg 2, 2628 CD, the Netherlands ; K. M. B. Jansen ; L. J. Ernst ; W. D van Driel
more authors

Generally, the viscoelastic properties of packaging materials used in the simulation models are obtained from the materials after postcuring. However these properties were observed to change during humidity conditioning and the thermal cycling. Two kinds of packaging materials are tested, one is molding compound and another is underfill. All samples are cured according to the curing procedure, postcured at 180degC. Before the test, first the samples are pre-dried at 125degC for 24 hours and then preconditioned at 60degC/60%RH for 40 hours. Secondly, one reflow at 260degC. Finally, all samples are subjected to thermal cycling. Thermal cycling temperature range is from -65degC to 150degC and every cycle is finished in 30 minutes. For the DMA test, a TA Instrument Q800 is used. Test results show the glass modulus, rubber modulus and glass transition temperature increase with the number of thermal cycles. This change in materials after humidity and thermal treatment is here referred to as aging. The finite element software Marc is used to simulate the internal change of stress and displacement. The simulation result shows that the total warpage has increased a little at the corner of passive die, which is where the critical cracks and crazes were found in our qualification tests. And the Von Mises stresses increase after thermal cycling.

Published in:

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on

Date of Conference:

20-23 April 2008