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Testing solder interconnect reliability under drop impact loading conditions

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4 Author(s)
Zaal, J.J.M. ; Delft Univ. of Technol., Delft ; Hochstenbach, H.P. ; van Driel, W.D. ; Zhang, G.Q.

A correlation between the drop impact test and cold bump pull test is investigated. This can be divided into three parts. First by investigating the cold bump pull test apparatus for uncontrolled parameters that might introduce a bias or spread in the results. Secondly by means of modeling the cold bump pull test to investigate solder bump deformation and solder bump loading during pull off. Finally in a comparison the differences and similarities between the two tests are briefly discussed and some observations concerning the solder joint performance are presented. The correlation between the two tests is focused on a method capable of translating the loading conditions experienced in the drop impact test towards a cold bump pull test prescription. Several numerical simulations have been used to investigate the solder ball during deformation and destruction. The cold bump pull experiments are used to rule out as much variances aspossible and improvements for the cold bump pull apparatus are proposed.

Published in:

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on

Date of Conference:

20-23 April 2008