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Thermal analysis automation system for semiconductor package

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6 Author(s)
Yuanxiang Zhang ; Fairchild-ZJUT Joint Lab, Zhejiang University of Technology, Hangzhou 310032, China ; Lihua Liang ; Yangjian Xia ; Yong Liu
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The technology of thermal analysis is very important in development of a new generation of IC package design, which aims to obtain the temperature distribution and thermal resistance of package. Most IC design engineers and package engineers have many difficulties in performing thermal analysis because they are familiar with the product structure but poor in thermal-physical modeling and FEA skills. To assist IC design engineers and package engineers to perform thermal analysis efficiently and accurately, a fully automation system (WBExcel) that has the ability to complete the whole package thermal analysis automatically has been developed based on ANSYSreg Workbench and Excel. The WBExcel consist of four modules: a Package Model Information Library, an executable Wizard System, a Package Material Library and an Environment Library. The general methodology of developing this automation system is introduced. The application on PCB level analysis and component level analysis is presented and indicates the reliability and efficiency of WBExcel.

Published in:

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on

Date of Conference:

20-23 April 2008