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Cavitation instability in the plastic IC packaging material due to moisture-induced vapor pressure and thermal stress

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5 Author(s)
Li Zhigang ; Inst. of Appl. Mech. & Biomed. Eng., Taiyuan Univ. of Technol., Taiyuan ; Niu Xiaoyan ; Ma Yong ; Shu Xuefeng
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In this paper, a representative material cell containing a single microvoid is used to investigate void growth under combined vapor pressure and thermal stress. The plastic IC packaging material is assumed to be transversely isotropic and its strain energy includes a power-law reinforcing model has been analyzed. Using the theory of cavity formation and unstable void growth in incompressible hyper-elastic material, we gained an analytical relation between the applied traction (moisture-induced vapor pressure and thermal stress) and void volume fraction in forementioned materials. Numerical analysis is given of such polymers electronic packaging materials occurred "popcorn" critical load burst. Numerical results indicate that the critical stress for unstable void growth is very sensitive to the initial porosity. Through numerical simulation, we also obtained the critical stress is related to the hardening exponent n and the strength of the fiber reinforcement parameter alpha.

Published in:

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on

Date of Conference:

20-23 April 2008