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The thermal-structural analysis of plastic substrate based display using experiments and FEM simulations

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6 Author(s)
Chang-chun Gu ; School of Mechatronics Engineering, University of Electronic Science and Technology of China, Chengdu, Sichuan, 610054, China ; Ming-quan Shi ; Ping Yang ; Leon Xu
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Plastic substrate based display could potentially be widely used in electronic devices. Although with many advantages, it may potentially fail because of temperature induced stresses, or structural loads, or material damage resulted from the other environment factors in the practical use. On the other hand, as a relatively new display, the material behavior of the plastic substrate based display has been well understood. In many cases, there is no report of the material properties of those in the display assembly. In this study, we proposed an alternative method to estimate the material properties in the display assembly using experiments and FEM simulations. With the material data from this methodology, the thermal-structural analysis of the plastic substrate based display was performed using FEA. The results matches well with those from the experiments.

Published in:

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on

Date of Conference:

20-23 April 2008