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Can temperature shock tests speed up development of reliable components for automotive applications

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2 Author(s)
Pufall, R. ; Infineon Technol. AG, Neubiberg ; Kanert, W.

Experience shows that chip package interaction is a dominant cause for failures of electronic components. Optimising the technology by applying the standard temperature cycling test to detect these failures is very time consuming and not any more compatible with today's development cycles. This paper provides a decision basis to speed up technology qualification by using TS (thermal shock) instead of TC (thermal cycling).

Published in:

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on

Date of Conference:

20-23 April 2008