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A comprehensive shear-testing facility for joint-scale solder samples

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3 Author(s)
Herkommer, D. ; Stokes Res. Inst., Univ. of Limerick, Limerick ; Reid, M. ; Punch, J.

This paper describes the design and commissioning of a comprehensive shear testing apparatus for joint-scale solder samples. It allows for conducting most testing methods that are usually performed on solder specimens at highest precision for different temperatures. In-situ observation of the solder joint can be performed for micro structural studies. The various design features and the specimen manufacturing process are explained in detail. Creep test results at room temperature on Sn96.5Ag3.0Cu0.5 and eutectic Sn63Pb37 solder are presented. Secondary creep strain and transition times between creep phases are investigated to demonstrate the capabilities of the shear-testing facility.

Published in:

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on

Date of Conference:

20-23 April 2008