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Next Generation Smart Power Technologies - Challenges and Innovations Enabling Complex SoC Integration

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6 Author(s)
Marnix Tack ; AMIS, Oudenaarde, Belgium; AMIS, Vilvoorde, Belgium ; Peter Moens ; Renaud Gillon ; Johan Janssens
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This paper highlights the key figure-of-merits of SPTs and ongoing technology innovations, such as vertical DMOS switches, Deep Trench Isolation, Power Metal, and SOA-simulation. Examples are given of automotive and telecom applications that benefit from these advanced SPTs. As such these developments will enable truly Smart Power SoC applications.

Published in:

2008 IEEE International Solid-State Circuits Conference - Digest of Technical Papers

Date of Conference:

3-7 Feb. 2008