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Thermal Characteristics and Thermomechanical Reliability of Board-Level Stacked-Die Packages Subjected to Coupled Power and Thermal Cycling Test

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4 Author(s)
Tong Hong Wang ; Central Labs., Adv. Semicond. Eng., Inc., Kaohsiung ; Chang-Chi Lee ; Yi-Shao Lai ; Yu-Cheng Lin

The sequential thermal-mechanical coupling analysis, which solves in turn the transient temperature field and subsequent thermomechanical deformations, is performed to investigate thermal characteristics along with fatigue reliability of a board-level stacked-die package under coupled power and thermal cycling test conditions. Different powering conditions and sequences are compared. From the numerical results, we note that under coupled power and thermal cycling tests, reliability performances of a board-level stacked-die package should be similar as long as the total power dissipation prescribed to the package is identical, regardless of how the power distributes among separate dies.

Published in:

Components and Packaging Technologies, IEEE Transactions on  (Volume:31 ,  Issue: 2 )

Date of Publication:

June 2008

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