By Topic

A Fourier Series-Based Analytical Solution for Three-Dimensional Conjugate Heat Transfer Problems in Microprocessor Cooling

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Ankireddi, S. ; Semicond. Packaging Group, Sun Microsyst., Inc., Santa Clara, CA ; Pecavar, S.

A fully analytical steady state solution is presented for the problem of 3-D conjugate heat transfer in flip chip electronic packages with multiple general areal power sources, cooled by heatsinks using forced convection. The inherent simplicity of the proposed approach allows for expedient yet detailed package cooling/thermal analysis and evaluation of what-if scenarios while requiring only modest computational resources such as a personal computer. The soundness of the approach presented is demonstrated via excellent correlation with the results of experimental tests on flip-chip thermal test packages in a wind tunnel. The techniques developed herein are fairly general and can be readily adapted to other package designs wherein the primary heat transfer path is through the die, die-lid interface, lid, lid-sink interface and heatsink to the airflow through the fins.

Published in:

Components and Packaging Technologies, IEEE Transactions on  (Volume:31 ,  Issue: 2 )