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Adhesive and mechanical properties of Carbon nanotube filled thermoplastic polyimide films for microelectronics packaging

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1 Author(s)
Saeed, M.B. ; Dept. of Aerosp. Eng., Nat. Univ. of Sci. & Technol., Risalpur

In this study the mechanical and adhesive properties of Multi-walled carbon nano- tubes (MWNTs) filled polyimide composite films (MWNT-PI) are investigated to determine their usefulness as thermo-conductive packaging materials in microelectronics. MWNTs were mixed in low wt% during synthesis at poly(amic acid) (PAA) stage. MWNT-PI films were characterized using DMTA and tensile testing to determine viscoelastic behavior and mechanical properties. Adhesive strength and adhesive energy of bonded samples were determined in accordance with ASTM D 1002 and ASTM D 3762 respectively. The fractured surfaces were examined by scanning electron microscope (SEM) to determine failure patterns. The results showed that viscoelastic behavior of MWNT-PI films changes from liquid-like to solid-like with increasing MWNT wt content. Elastic modulus and strength at break of the composite films were found to increase with increase in MWNTs wt%. However, elongation at break and breaking energy of films and lap shear strength and adhesive energy of bonded samples were found to initially increase with increase in MWNTs wt%, but then after a critical value decreases.

Published in:

Emerging Technologies, 2007. ICET 2007. International Conference on

Date of Conference:

12-13 Nov. 2007