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Interconnect length impact investigation by measurements

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3 Author(s)
Sotman, M. ; M.T.M. Sci. Ind. Center, Intel Israel, Haifa ; Kostinsky, A. ; Zobin, G.

The paper describes novel methodology for high frequency link/bus validation. For the first time the entire interconnect length range is covered. Frequency shmoo emulates PCB length change. The discovered resonance behavior correlates perfectly with theoretical prediction.

Published in:

Signal Propagation on Interconnects, 2007. SPI 2007. IEEE Workshop on

Date of Conference:

13-16 May 2007