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Cooling management of a protruding electronic components by using a phase change material heat sink

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2 Author(s)
Faraji, M. ; Univ. Cadi Ayyad, Marrakech ; El Qarnia, H.

The aim of the present work is to study the thermal performance of a hybrid heat sink used for cooling management of protruding substrate-mounted electronic chips. The power generated in electronic chips is dissipated in phase change material (PCM) that filled a rectangular enclosure. The advantage of using this cooling strategy is that the PCMs are able to absorb a high amount of heat generated by IC without operating the fan. A (2D) mathematical model was developed for a heat sink. Several experiment simulations were conducted to analyze the effect of the substrate thermal conductivity on the cooling of the chips.

Published in:

Electronics, Circuits and Systems, 2007. ICECS 2007. 14th IEEE International Conference on

Date of Conference:

11-14 Dec. 2007

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