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Transfer mold manufacturing technology has been successfully applied to intelligent power modules (IPM) for the 600 V and 1200 V range for more than 9 years now. In this period the current range of the IPMs has been successively increased from 3 A to 50 A and the packaging technology has gone significant improvements with respect to package weight and thermal resistance. At the lower end of the drive power, e.g. drives having a typical power rating of 100 W, inverters were built recently utilizing discrete IGBT / MOSFET and high voltage integrated circuits (HVIC). The new highly integrated surface mountable IPM allows a significant space reduction and the employment of extended protection functions like short circuit (SC) and over temperature (OT) protection with a space requirement on a printed circuit board (PCB) of less than the half of the equivalent of three HVICs only. Integration provides higher reliability and space effective solutions for higher power density of drives. The paper presents the used single chip technology, describes the key features and concludes with an evaluation of the achievable output power as a result of different cooling approaches verified on an evaluation board.