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Process characterization of aluminum ribbon bond

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4 Author(s)
Lim, F. ; SCG IND, Seremban ; Wo Low ; Lee, C. ; Rizal, B.

Increase in wire connections has known to gain in Rdson electrical performance. The complexity of this multiple bonding process has impact on throughput reduction. Ribbon allows the creation of an interconnect with larger cross section to substitute multiple wires to be bonded with no sacrifice on the electrical performances whilst gaining higher throughput. The conventional parallel bonding for ribbon interconnect has limit the design rule boundary to have bigger die size and disallow twisting of the ribbon. Large forced angle bonding resulted in ribbon heel crack and tear off at the twisting interface. This study will cover the inter-relationship bonding tool selection, equipment and process parameters characterization on ribbon bond with non-parallel bonding. The methodologies applied include corner matrix study, Response Surface Methodology (RSM) and full factorial DOE through DMAIC approach to resolve ribbon heel crack and teal off.

Published in:

Electronic Materials and Packaging, 2007. EMAP 2007. International Conference on

Date of Conference:

19-22 Nov. 2007