Scheduled System Maintenance:
On Monday, April 27th, IEEE Xplore will undergo scheduled maintenance from 1:00 PM - 3:00 PM ET (17:00 - 19:00 UTC). No interruption in service is anticipated.
By Topic

Electrical and reliability properties of isotropic conductive adhesives (ICAs) on immersion silver printed wiring boards (PWBs)

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Jeahuck Lee ; Dept. of Electr. & Comput. Eng., Portland State Univ., Portland, OR ; Cho, C.S. ; Morris, J.E.

To completely eliminate lead (Pb) from electronics, the printed wiring board (PWB) must also change from hot-air- leveled solder (SnPb) to alternative metallic finishes, such as immersion-silver (Ag), immersion-tin (Sn), electroless nickel (Ni)/immersion-gold (Au) and organic solderability preservative (OSP). Especially, immersion-Ag is one of the leading Pb-free final finish choices for many OEMs in the telecommunications, computer, automotive and consumer electronics industries, because of its excellent properties and reasonable cost. This paper presents the electrical properties of Ag epoxy composite isotropic conductive adhesives (ICAs) materials on Cu-finished and immersion-Ag finished PWBs, as solder replacements for SMT or flip chip technologies. All PWBs were subjected to 85degC/85% relative humidity (RH) aging testing, with junction resistance monitored for comparison of the immersion-Ag board to the Cu-finished board as a control. We expected that the corrosion potential, which is one of main causes to degrade conductivity between ICAs and PWB, should be eliminated by the use of Ag contact pads with the Ag epoxy composite ICAs materials. Not only is the junction resistance of immersion-Ag finished boards lower than that of Cu finished boards, but its junction resistance changes are smaller than those of Cu-finished boards, as expected.

Published in:

Electronic Materials and Packaging, 2007. EMAP 2007. International Conference on

Date of Conference:

19-22 Nov. 2007