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Testing and Specifying Thermal Performance of DC-DC Power Modules used in Sealed Box Applications

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1 Author(s)
Andrzej Wojtasik ; Ericsson Power Modules, 126-25 Stockholm, Sweden

Output power derating vs. ambient temperature and airflow is a widely used method for defining the thermal limitations of dc-dc power modules. However, this method is not suitable for sealed box applications where the modules are mainly conduction cooled by means of an external heatsink often referred to as a "cold wall" or "cold plate". In this paper a new method for testing and presentation of results for dc-dc modules in such applications is proposed.

Published in:

Semiconductor Thermal Measurement and Management Symposium, 2008. Semi-Therm 2008. Twenty-fourth Annual IEEE

Date of Conference:

16-20 March 2008