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New developments in the electronics industry have resulted in higher power chips. Unfortunately as these devices run at higher power, they dramatically increase the heat produced. New thermal management materials that exceed the performance of current commercially available greases, gels and adhesives were developed to meet these higher thermal loads. These materials were created using a dense particle packing theory. Rather than use empirical scattershot approaches, this new method uses a mathematical tool to optimize formulations. This theory not only helped produce new thermal materials but also dramatically reduced developmental time.