By Topic

Mathematical Methods for the Rapid Development of New High Performance Thermal Interface Materials

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)

New developments in the electronics industry have resulted in higher power chips. Unfortunately as these devices run at higher power, they dramatically increase the heat produced. New thermal management materials that exceed the performance of current commercially available greases, gels and adhesives were developed to meet these higher thermal loads. These materials were created using a dense particle packing theory. Rather than use empirical scattershot approaches, this new method uses a mathematical tool to optimize formulations. This theory not only helped produce new thermal materials but also dramatically reduced developmental time.

Published in:

Semiconductor Thermal Measurement and Management Symposium, 2008. Semi-Therm 2008. Twenty-fourth Annual IEEE

Date of Conference:

16-20 March 2008