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An Integrated-Circuit Approach to Extracellular Microelectrodes

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3 Author(s)
Wise, K.D. ; Department of Electrical Engineering, Stanford University, Stanford, Calif. ; Angell, J.B. ; Starr, Arnold

This paper describes a new multielectrode microprobe which utilizes integrated-circuit fabrication techniques to overcome many of the problems associated with conventional microelectrodes. The probe structure consists of an array of gold electrodes which are supported on a silicon carrier and which project beyond the carrier for a distance of about 50 ¿ to allow a close approach to active neurons. These electrodes are covered with a thin (0.4-¿) layer of silicon dioxide which is selectively removed at the electrode tips using high-resolution photoengraving techniques to define the recording areas precisely. The processing sequence described permits any two-dimensional electrode array to be realized. Interelectrode spacings can be accurately controlled in the range from 10 to 20 ¿ or larger, and electrode-tip diameters can be as small as 2 ¿.

Published in:

Biomedical Engineering, IEEE Transactions on  (Volume:BME-17 ,  Issue: 3 )

Date of Publication:

July 1970

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