IEEE.org| IEEE Xplore Digital Library| IEEE Standards| IEEE Spectrum| More Sites

Cart (Loading....) | Create Account | 

Close category search window
Author Searchbeta |  Advanced Search  |  Preferences |  Search Tips  |  More Search Options  
 
Browse Journals & Magazines > Advanced Packaging, IEEE Tran ...> Volume:31 Issue:2 Help

Effects of {\hbox {CNT/BaTiO}}_{3} Composite Particles Prepared by Mechanical Process on Dielectric Properties of Epoxy Hybrid Films

Full Text Sign-In or Purchase

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing! close button
puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Hui Joon Park ; Hybrid Mater. Res. Center, Korea Inst. of Sci. & Technol., Seoul ; Seung Min Hong ; Sang-Soo Lee ; Kim, Junkyung
more authors

A new type of composite filler mechanically treated with multi-walled carbon nanotubes (MWNTs) and (BT) particles was prepared to produce higher dielectric properties in the composite. The hybrid film fabricated by incorporating these composite fillers in an epoxy matrix had a high dielectric constant and similar dielectric loss as compared to the composite which contained neat BT particles. The dielectric properties of these hybrid films were found to be dependent on both the content of MWNTs and mechanical processing time. Results suggest that this novel hybrid film composed of the composite filler and the epoxy matrix can be used for embedded capacitor material.

Published in:
Advanced Packaging, IEEE Transactions on  (Volume:31 ,  Issue: 2 )

Date of Publication: May 2008

Page(s):
417 - 422
ISSN :
1521-3323
INSPEC Accession Number:
9992333
Digital Object Identifier :
10.1109/TADVP.2008.920348
Product Type:
Journals & Magazines
Date of Current Version :
07 May 2008
Issue Date :
May 2008
Sponsored by :
IEEE Components, Packaging, and Manufacturing Technology Society

IEEE Account

Purchase Details

Profile Information

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.