By Topic

Experimental setup for the measurement of local temperature in electronic component during the steady and transient state

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Sonia Dhokkar ; Laboratoire d¿Etudes Thermiques, UMR C.N.R.S n°6608, ENSMA-BP 40109 F-86961 FUTUROSCOPE- France ; Patrick Lagonotte ; Andre Piteau

Non-contact optical methods can be used for submicron surface thermal characterization of active semiconductor devices. In this work, an experimental device based on near infra-red radiometric method is presented. This device is breadboard to analyze a thermal behaviour of electronic component in steadied and transient state. The absolute temperature distribution is measured at the micron scale. The obtained results highlight the excellent spatial resolution of the experimental measurement apparatus and its great sensitivity for detection of weak thermal emission variations.

Published in:

2007 50th Midwest Symposium on Circuits and Systems

Date of Conference:

5-8 Aug. 2007