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Experimental setup for the measurement of local temperature in electronic component during the steady and transient state

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3 Author(s)
Dhokkar, S. ; ENSMA-BP 40109 F-86961 FUTUROSCOPE- France, Creteil ; Lagonotte, P. ; Piteau, A.

Non-contact optical methods can be used for submicron surface thermal characterization of active semiconductor devices. In this work, an experimental device based on near infra-red radiometric method is presented. This device is breadboard to analyze a thermal behaviour of electronic component in steadied and transient state. The absolute temperature distribution is measured at the micron scale. The obtained results highlight the excellent spatial resolution of the experimental measurement apparatus and its great sensitivity for detection of weak thermal emission variations.

Published in:

Circuits and Systems, 2007. MWSCAS 2007. 50th Midwest Symposium on

Date of Conference:

5-8 Aug. 2007