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High-frequency surface acoustic wave (SAW) devices fabricated by contact-transferred and mask-embedded lithography

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4 Author(s)
Chin-Hsin Liu ; Dept. of Mech. Eng., Nat. Cheng Kung Univ., Tainan ; Chiu, Cheng-Yu ; Lee, Yung-Chun ; Shuo Hung Chang

This paper reports the application of a newly developed lithography method, the contact transfer and mask-embedded lithography (CMEL), in fabricating high-frequency (~2 GHz) surface acoustic wave (SAW) filters. In sort, CMEL utilizes a thin metal film deposited on an anti-adhesion layer and a silicon mold with pre-fabricated features. The metal film bearing the mold's surface pattern can be transferred into a photo-resist layer deposited on a substrate. Subsequent etchings complete the lithography and the micro/nano-fabrication. To demonstrate CMEL and its potential, we apply CMEL for fabricating inter-digital transducers of SAW filters with a line width down to 500 nm. Using a LiNbO3 substrate, the operating frequency can reach 1.8 to 2 GHz based on this simple and easy-to-implement lithography method. Details in the CMEL, the lithography results, the high-frequency performance of the fabricated SAW devices, as well as future developments of this simple lithography method will be addressed.

Published in:

Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on

Date of Conference:

6-9 Jan. 2008