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Collimated aerosol beam deposition: sub 5-μm resolution of printed actives and passives

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10 Author(s)
Schulz, D.L. ; Dept. of Mech. Eng., North Dakota State Univ., Fargo, ND ; Hoey, J.M. ; Thompson, D. ; Swenson, O.F.
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Materials deposition based upon directed aerosol flow has the potential of finding application in the field of flexible electronics where a low-temperature route to printed transistors with high mobilities remains elusive. NDSU has been actively engaged in addressing this opportunity from the following two perspectives: (1) developing an appreciation of the basic physics that dominate aerosol beam deposition toward engineering a robust method that allows the realization of deposited features with sub-5 mum resolution; and, (2) developing an understanding of the mechanistic transformations of silane - based precursor inks toward the formation of electronic materials at atmospheric-pressatmospheric-pressureure. In this paper, we will briefly discuss the genesis of a new a materials deposition method termed collimated aerosol beam direct-write (CAB- DW) where precision linewidth control has been realized using a combined theoretical/experimental approach. Next, we will discuss progress using Si6H12 (cyclohexasilane - a liquid silane) as a precursor for solution-processed diodes and transistors. Finally, we demonstrate the ability to CAB- DW Si6H12-based precursor inks for printing Si-based semiconductors.

Published in:

Flexible Electronics and Displays Conference and Exhibition, 2008

Date of Conference:

21-24 Jan. 2008