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Tutorial 3: Process Technology Development and New Design Opportunities in 3D Integration Technology

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3D integration offers inter-strata interconnect with high connectivity density, low parasitics, and shorter lengths. This bring advantages in increased interconnect bandwidth, reduced interconnect latency and reduced power consumption in comparison with individual packaged chips on a board or packages with wire bonded stacked die. 3D integration can compete with, or even surpass, SoC (system on a chip) integration in terms of interconnect performance while allowing for differentiated process technologies for the various strata.

Published in:

Quality Electronic Design, 2008. ISQED 2008. 9th International Symposium on

Date of Conference:

17-19 March 2008