By Topic

Uncertainty Analysis in Spatial Thermal Measurements Using Infrared Line Scanners

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
RubÉn Usamentiaga ; Dept. of Comput. Sci. & Eng., Oviedo Univ., Gijon ; Daniel F. Garcia ; Julio Molleda

Thermographic devices that are able to acquire images, such as infrared line scanners (IRLSs), are becoming increasingly popular. One of the major issues when working with this kind of device is spatial calibration, which is necessary to extract metric information from images. In this paper, a spatial calibration procedure for IRLSs is proposed. The procedure is based on a geometrical model to calculate the spatial position of all of the samples. The model also calculates the length of the semiaxes of the elliptical surface of all of the samples. In addition, an uncertainty analysis has been carried out, providing the combined standard uncertainty of the measurement. This analysis provides information about the uncertainty of the spatial calibration procedure, which is a function of the standard uncertainty of the IRLS parameters. The spatial calibration procedure has been applied to a commercial IRLS to verify the proposed process. The result of the spatial calibration procedure is a straightforward method to calculate the position and dimensions of all of the temperature samples. This work is an important contribution to the development and exploitation of infrared image processing systems.

Published in:

IEEE Transactions on Instrumentation and Measurement  (Volume:57 ,  Issue: 9 )