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The paper presents a generalized transmission line model able to describe the high-frequency mixed-mode propagation along electrical interconnects. The model is derived from a full-wave formulation and extends the validity of the standard transmission line (TL) model to frequency ranges where the propagation is no longer of transmission electron microscopy (TEM)-type. This generalized TL model describes the high-frequency differential and common mode propagation and the mode conversion. Within its validity limits, the proposed model provides solutions in good agreement with those obtained through full-wave models. Case studies are carried out to evaluate the high-frequency mode conversion in asymmetric interconnects.
Published in:
Advanced Packaging, IEEE Transactions on
(Volume:31
,
Issue:
2
)
Date of Publication: May 2008
- Page(s):
- 275 - 284
- ISSN :
- 1521-3323
- INSPEC Accession Number:
- 9992319
- Digital Object Identifier :
- 10.1109/TADVP.2008.920373
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 07 May 2008
- Issue Date :
- May 2008
- Sponsored by :
- IEEE Components, Packaging, and Manufacturing Technology Society
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