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Heat driven cooling of portable electronics using thermoelectric technology

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3 Author(s)
Solbrekken, G.L. ; Dept. of Mech. & Aerosp. Eng., Missouri-Columbia Univ., Columbia, MO ; Yazawa, K. ; Bar-Cohen, A.

A novel ldquoshunt attachrdquo configuration for chip-scale thermoelectric (TE) generation of electric power from microprocessor waste heat is described, modeled, and parametrically analyzed. The generated electricity is used to drive a cooling fan that convectively cools the chip. A prototype using heat-driven cooling through off-the-shelf TE modules and a low-voltage fan was built and successfully applied to the thermal management of a high-power mobile processor in a portable equipment form factor.

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:31 ,  Issue: 2 )