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A miniaturized probe for MEMs based devices used in OCT application has been developed. Laser and mechanical dicing are used for singulating the released MEMs devices, however resulted in damaged devices. Therefore, thick photoresist is used to overcome and protect the devices during dicing. A fluxless solder ball process using different ball dimensions are experimented. Silicon bench is used for assembly of optical fiber and GRIN lens. Flex circuit is used to connect to the outside world by means of wirebonding.