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3D Embedding and Interconnection of Ultra Thin (≪ 20 μm) Silicon Dies

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7 Author(s)

This paper presents the process for the embedding of thin dies in a polymeric layer developed at IMEC. The different aspects of the fabrication process are described: the die thinning and singulation as well as the embedding itself including the redistribution of the thin die contacts. The embedding build-up is composed of photosensitive dielectric BCB and copper plated metal films. Thinning, singulation and embedding of 15 μm thick Si dies is shown and electrical connection to pads having a pitch of 60 μm is demonstrated.

Published in:

Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th

Date of Conference:

10-12 Dec. 2007