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Use of Elastic Conductive Adhesive as the Bonding Agent for the Fabrication of Vertical Structure GaN-Based LEDs on Flexible Metal Substrate

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10 Author(s)

Through the use of elastic conductive adhesive (ECA) as the bonding agent and patterned laser lift-off technology, a flexible metal substrate technology for the fabrication of vertical structured GaN-based light-emitting diodes (flex-LEDs) was proposed and demonstrated. It showed that the flex-LEDs have negligible changes in dominant wavelength-current and light output intensity-current-voltage characteristics when subjected to an external bending stress, indicating that the ECA used in the present technology performed well as a buffer to external stresses. As compared with conventional sapphire substrate GaN-based LEDs, Flex-LEDs with a chip size of 600 x 600 mum2 showed an increase in light output intensity (power) about 216% (80%) at 120 mA with an essential decrease in forward voltage from 3.51 to 3.3 V.

Published in:

Photonics Technology Letters, IEEE  (Volume:20 ,  Issue: 7 )

Date of Publication:

April1, 2008

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