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Active Electrode Arrays by Chip Embedding in a Flexible Silicone Carrier

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6 Author(s)
Bulcke, M.V. ; Interuniv. Micro Electron. Center, Leuven ; Baert, K. ; Beyne, E. ; Gonzalez, M.
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Future cochlear implants demand a higher density of stimulation sites (electrodes) and enhanced functionality (e.g. feedback information). The current generation of implanted cochlear prostheses is making use of a completely "passive scheme" and cannot meet these requirements. An "all-silicon" concept integrating active components with passive electrodes in silicon has been proposed but does not offer the flexibility/stretchability of current silicone-based devices. This paper introduces a novel concept based on silicon chip embedding in a flexible silicone carrier. The process and experimental results will be presented. The concept is also applicable to other types of implanted electrodes, e.g. retinal implants

Published in:

Engineering in Medicine and Biology Society, 2006. EMBS '06. 28th Annual International Conference of the IEEE

Date of Conference:

Aug. 30 2006-Sept. 3 2006