By Topic

Dry Self-Assembly & Gang bonding of micro-components from silicon carrier to substrate wafer

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Ong, Y.Y. ; Inst. of Microelectron., Singapore ; Lim, Y.L. ; Yan, L.L. ; Liao, E.B.
more authors

We have demonstrated parallel self-assembly process based on mechanical shape-matching between the protrusions of micro-components and the cavities on an 8" carrier wafer. With external agitation, 1 times 1 mm2 micro-components fall into ~2000 receptor sites on the carrier wafer. The reproducibility of self-assembly is shown by an average assembly yield of 95.8plusmn2.1% within 10 min for 9 repeated trials. The assembled micro-components were then aligned and gang bonded to the substrate wafer. The yield for gang bonding is about 98%. SU-8 can be used alternatively to fabricate the protrusions on the micro-components instead of the usual silicon DRIE process. These micro-components with SU-8 protrusions can be self-assembled in a similar way as those micro-components with silicon protrusions.

Published in:

Electronics Manufacturing and Technology, 31st International Conference on

Date of Conference:

8-10 Nov. 2007