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Dry Self-Assembly & Gang bonding of micro-components from silicon carrier to substrate wafer

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5 Author(s)
Y. Y. Ong ; Institute of Microelectronics, 11 Science Park Road, Science Park II, Singapore 117685. Tel: (65) 6770 5422, Email: ; Y. L. Lim ; L. L. Yan ; E. B. Liao
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We have demonstrated parallel self-assembly process based on mechanical shape-matching between the protrusions of micro-components and the cavities on an 8" carrier wafer. With external agitation, 1 times 1 mm2 micro-components fall into ~2000 receptor sites on the carrier wafer. The reproducibility of self-assembly is shown by an average assembly yield of 95.8plusmn2.1% within 10 min for 9 repeated trials. The assembled micro-components were then aligned and gang bonded to the substrate wafer. The yield for gang bonding is about 98%. SU-8 can be used alternatively to fabricate the protrusions on the micro-components instead of the usual silicon DRIE process. These micro-components with SU-8 protrusions can be self-assembled in a similar way as those micro-components with silicon protrusions.

Published in:

Electronics Manufacturing and Technology, 31st International Conference on

Date of Conference:

8-10 Nov. 2007