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SAM interpretation of interfacial anomaly in flip-chip BGA package with 65 nm Cu/low-κ integrated circuits device

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4 Author(s)
Ka Yau Lee ; Infineon Technologies Asia Pacific Pte Ltd, Assembly & Interconnect Technology, 168 Kallang Way Singapore 349253. Email: ; Priscilla Lee ; Ai Min Tan ; Charles Lee

In the course of qualifying a flip chip BGA package with a 65 nm Cu/low-κ device, an unusual interfacial phenomenon was detected at the interface between die and underfill using a scanning acoustic microscope. Inhomogeneous acoustic intensity with oriented "scallop-like" pockets was found around the solder bumps at the die and underfill interface. Close inspection of the underfill material after cross-sectioning and planar lapping revealed non-uniform filler distribution, resulting in the formation of resin-rich "scallop-like" pockets around the bumps. A correlation between inhomogeneous acoustic intensity and filler distribution is discussed and the physical methodology of analysis is described in this paper.

Published in:

Electronics Manufacturing and Technology, 31st International Conference on

Date of Conference:

8-10 Nov. 2007